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Strategic Project Management o Openly researches the root cause of customer problems to drive innovative improvements o Establish the viability of new Semiconductor equipment or materials using EMI business process for maturing tool performance to HVM levels. o Publish detailed documentation reflecting work plans, results, interpretation, conclusions and recommendations. o Develop and Mature Equipment \u25aa Collaborate with vendors on strategic process/hardware evaluations. \u25aa Drive innovative solutions for hardware issues to improve system performance and maturity. \u25aa Follow established policies to protect confidential information and company IP. Tactical Project Management o Execute Preflight Meetings for installation, modifications/upgrades and maintenance support for assigned PDE Development equipment sets. o Demonstrate ownership of assigned projects including, but not limited to, documentation, EMI tool maturity, TIQ, and system finger printing. o Summarize and publish plans, progress on existing experimental work, and document work in EMR's, Project Sheets and EMI Documents. o Ensure Monthly CIP meetings are being held to review tool improvement initiatives. o Maintain and publish roadmaps to define work/CIP's required to move toolsets from one EMI level to the next in preparation for transfer to HVM. o Maintain work record by updating ETO and EPD for all work performed. o Work with process engineer to determine issues we are trying to fix, then define and publish a detailed plan with action items to correct the issue with pre and post testing to confirm the fix is appropriate. o Work with Facilities Engineering, PHA, Trades, and Vendors in support of projects, following the ECBP business process. o Meet monthly with Process Owners on assigned workstations to review new processes and process requirements being added to workstations. o Attend assigned passdown meetings and collaborate with others in the group to help the area move forward toward common goals. o Attend and participate in scheduled TPM meetings for workstation you are supporting. o Be active in cost reduction and cost of ownership projects for given WS. o Act as area expert and resource for on shift equipment techs and engineers. o Provide training and documentation in support of equipment transfers to MDE and Production Fabs. o Ensure WS Documentation is up to date to include all related drawing, procedures, and web page information. o Provide written and oral communication to process development, other equipment development groups and manufacturing Fabs as needed. o Support leadership decisions and demonstrate company values. o Support and actively work towards group goals. o Project owners are expected to respond to issues 24X7 to insure projects are moving forward. o Promote a cooperative environment by maintaining a professional and positive work attitude/environment. o Maintain appropriate documentation in Inventor's Notebook of potential intellectual property. 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Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges. Work closely with multiple cross functional teams including defect team, probe testing team, and process module team. Able to work independently along with various projects inside of APTD team. Bachelor's degree in physics, chemistry, electrical engineering, mechanical engineering, material science, or other applied engineering discipline. Understanding on technical risk assessment, setup mitigation plan, FMEA, and SPC. Verbal and written communication skills in English Strong focus on advanced package technology (2.5D or 3D package, heterogeneous integration, or fan-out wafer level) research and development. Depth in packaging technologies such as BGA, fcCSP, WLCSP, SIP, TSV, and SOC. Hands on experience on flip chip die attach, thermo-compressive bonding, wafer clean, plasma activation. 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